Invention Grant
- Patent Title: Method of shielding a circuit board, circuit board, electromagnetic shield and method of manufacturing same
- Patent Title (中): 屏蔽电路板,电路板,电磁屏蔽及其制造方法
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Application No.: US12781307Application Date: 2010-05-17
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Publication No.: US08462519B2Publication Date: 2013-06-11
- Inventor: Esen Bayar , Steven David Clements , Graham James Quintal
- Applicant: Esen Bayar , Steven David Clements , Graham James Quintal
- Applicant Address: GB Hereford
- Assignee: ETL Systems Ltd.
- Current Assignee: ETL Systems Ltd.
- Current Assignee Address: GB Hereford
- Agency: DLA Piper LLP (US)
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
There is disclosed a method of shielding a circuit board, a circuit board, an electromagnetic shield and a method of manufacturing an electromagnetic shield. In an aspect, the method comprises placing a first electromagnetic shield over a first area of the circuit board and placing a second electromagnetic shield over a second area of the circuit board. At least one of the electromagnetic shields has at least one projection therefrom that contacts and makes electrical connection with a surface of the other electromagnetic shield when the shields are placed on the circuit board.
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