Invention Grant
- Patent Title: Injection mold
- Patent Title (中): 注塑模具
-
Application No.: US13018395Application Date: 2011-01-31
-
Publication No.: US08465271B2Publication Date: 2013-06-18
- Inventor: Gang-Fu Cai , Ya-Bo Zou , Xin-Jin Gui , Kun-Hsueh Chiang
- Applicant: Gang-Fu Cai , Ya-Bo Zou , Xin-Jin Gui , Kun-Hsueh Chiang
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Cheng-Ju Chiang
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
An injection mold for molding a product including an insert element, which includes a plurality of terminals each having a contacting portion, includes a male mold and a female mold movably engaged with the male mold. The male mold includes a male platen for fixing a fastening element therein. The fastening element defines a plurality of fastening grooves for fastening the contacting portions in a first male groove opened on the male platen. The male mold further includes a supporting element cooperating with the male platen to fixing a locating mold core in the male platen. A top end of the locating mold core projects into the first male groove and further defines a locating groove for fastening one contacting portion adjacent to a male sprue which is opened on the male platen and connected with the first male groove via a second male groove of the male platen.
Public/Granted literature
- US20120195991A1 INJECTION MOLD Public/Granted day:2012-08-02
Information query