发明授权
US08466017B2 Methods of making semiconductor devices having implanted sidewalls and devices made thereby
有权
制造具有植入侧壁的半导体器件的方法和由此制成的器件
- 专利标题: Methods of making semiconductor devices having implanted sidewalls and devices made thereby
- 专利标题(中): 制造具有植入侧壁的半导体器件的方法和由此制成的器件
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申请号: US12962823申请日: 2010-12-08
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公开(公告)号: US08466017B2公开(公告)日: 2013-06-18
- 发明人: David C. Sheridan , Andrew Ritenour
- 申请人: David C. Sheridan , Andrew Ritenour
- 申请人地址: US CA San Jose
- 专利权人: Power Integrations, Inc.
- 当前专利权人: Power Integrations, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Morris, Manning & Martin, LLP
- 代理商 Christopher W. Raimund
- 主分类号: H01L21/337
- IPC分类号: H01L21/337
摘要:
Semiconductor devices and methods of making the devices are described. The devices can be junction field-effect transistors (JFETs) or diodes such as junction barrier Schottky (JBS) diodes or PiN diodes. The devices are made using selective ion implantation using an implantation mask. The devices have implanted sidewalls formed by scattering of normal or near normal incident ions from the implantation mask. Vertical junction field-effect transistors with long channel length are also described. The devices can be made from a wide-bandgap semiconductor material such as silicon carbide (SiC) and can be used in high temperature and high power applications.
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