发明授权
US08466542B2 Stacked microelectronic assemblies having vias extending through bond pads
有权
堆叠的微电子组件具有延伸穿过接合焊盘的通孔
- 专利标题： Stacked microelectronic assemblies having vias extending through bond pads
- 专利标题（中）： 堆叠的微电子组件具有延伸穿过接合焊盘的通孔
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申请号： US12723039申请日： 2010-03-12
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公开(公告)号： US08466542B2公开(公告)日： 2013-06-18
- 发明人: Moshe Kriman , Osher Avsian , Belgacem Haba , Giles Humpston , Dmitri Burshtyn
- 申请人： Moshe Kriman , Osher Avsian , Belgacem Haba , Giles Humpston , Dmitri Burshtyn
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/02 ; H01L29/40
摘要：
A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.