A bus bar distributes power to a plurality of electronic components supported on a printed circuit board. One embodiment of the bus bar comprises a plurality of compressible contact pads made from an electronically conductive polymer, spaced along the bus bar for contacting conductive contacts that are coupled to a power domain or individual electronic component. The pads may be secured to the bus bar and the conductive traces using an electronically conductive epoxy adhesive. Rivets may then be used to secure the bus bar to the printed circuit board and compress the pads, which conform to the printed circuit board to make a reliable electrical connection with the conductive traces. The bus bar further comprises a plurality of current sense points disposed adjacent to the pads for measuring the amount of current provided to each power domain.