Invention Grant
US08472142B2 Method of making a bonded structure for an electrical component, and/or head gimbal assembly, head stack assembly, and disk drive unit incorporating the same
有权
制造用于电气部件的接合结构的方法和/或头部万向架组件，磁头组合组件和包括其的磁盘驱动单元
- Patent Title: Method of making a bonded structure for an electrical component, and/or head gimbal assembly, head stack assembly, and disk drive unit incorporating the same
- Patent Title (中): 制造用于电气部件的接合结构的方法和/或头部万向架组件，磁头组合组件和包括其的磁盘驱动单元
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Application No.: US11902253Application Date: 2007-09-20
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Publication No.: US08472142B2Publication Date: 2013-06-25
- Inventor: MingGao Yao , YiRu Xie
- Applicant: MingGao Yao , YiRu Xie
- Applicant Address: CN Hong Kong
- Assignee: SAE Magnetics (H.K.) Ltd.
- Current Assignee: SAE Magnetics (H.K.) Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Nixon & Vanderhye PC
- Main IPC: G11B5/60
- IPC: G11B5/60
Abstract:
The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.
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