A module adapted for use with a datacommunications equipment mounting structure includes: a generally upright divider panel; a cover panel disposed generally parallel to the divider panel, the cover panel and divider panel being spaced apart from each other to form a gap; and a plurality of telecommunications cables, each of the telecommunications cables comprising a plurality of telecommunications patch cords, the cables comprising bundled patch cords at a first end and unbundled patch cords at a second opposite end, the cables being positioned in the gap between the divider panel and cover panel. The bundled patch cords at the cable first end include first interconnection terminals, and the unbundled patch cords at the second end include second interconnection terminals. The first terminals are located at first edges of the divider and cover panels. The unbundled patch cords are separately moveable between a stored position, in which the second terminals are located at second edges of the divider and cover panels, and an extended position, in which the second terminals are positioned away from the second edges of the divider and cover panels.