发明授权
- 专利标题： Method for packaging light emitting diode
- 专利标题（中）： 封装发光二极管的方法
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申请号： US12049443申请日： 2008-03-17
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公开(公告)号： US08475696B2公开(公告)日： 2013-07-02
- 发明人: Chih-hsiang Lin , Ya-Lan Chuang , Pei-Jung Tsat , Shu-Ling Yeh , Chin-Lang Wu , Cing-Jiuh Kang , Hsin-Ching Kao
- 申请人： Chih-hsiang Lin , Ya-Lan Chuang , Pei-Jung Tsat , Shu-Ling Yeh , Chin-Lang Wu , Cing-Jiuh Kang , Hsin-Ching Kao
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： McClure, Qualey & Rodack, LLP
- 优先权： TW96140577A 20071029
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.
公开/授权文献
- US20090108496A1 METHOD FOR PACKAGING LIGHT EMITTING DIODE 公开/授权日：2009-04-30
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