发明授权
- 专利标题: Resin compound, resin composition, and resin-molded article
- 专利标题(中): 树脂组合物,树脂组合物和树脂模制品
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申请号: US13485087申请日: 2012-05-31
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公开(公告)号: US08476347B1公开(公告)日: 2013-07-02
- 发明人: Kenji Yao
- 申请人: Kenji Yao
- 申请人地址: JP Tokyo
- 专利权人: Fuji Xerox Co., Ltd.
- 当前专利权人: Fuji Xerox Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC.
- 优先权: JP2011-282872 20111226
- 主分类号: C08K5/523
- IPC分类号: C08K5/523
摘要:
A resin compound includes a reaction product of (A) polymer which is at least selected from aliphatic polyester and aliphatic polyamide and (B) an aromatic compound with a compositional ratio from 0.1 to 10 parts by weight with respect to 100 parts by weight of (A) and represented by the following Formula (1): wherein each of R1, R2, and R3 represents a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, or a substituted or unsubstituted aromatic group having 6 to 10 carbon atoms; each of R4, R5, R6, and R7 represents a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 10 carbon atoms; each dm and n independently represents an integer from 0 to 3; and each of p and q represents an integer from 0 to 4.