Invention Grant
- Patent Title: Light emitting devices and methods of manufacturing the same
- Patent Title (中): 发光装置及其制造方法
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Application No.: US12659151Application Date: 2010-02-26
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Publication No.: US08476670B2Publication Date: 2013-07-02
- Inventor: Jun-youn Kim , Bok-ki Min , Hyun-gi Hong , Jae-won Lee
- Applicant: Jun-youn Kim , Bok-ki Min , Hyun-gi Hong , Jae-won Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0079189 20090826
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
Light emitting devices and methods of manufacturing the light emitting devices. The light emitting devices include a silicon substrate; a metal buffer layer on the silicon substrate, a patterned dispersion Bragg reflection (DBR) layer on the metal buffer layer; and a nitride-based thin film layer on the patterned DBR layer and regions between patterns of the DBR layer.
Public/Granted literature
- US20110049549A1 Light emitting devices and methods of manufacturing the same Public/Granted day:2011-03-03
Information query
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