Invention Grant
- Patent Title: Relay
- Patent Title (中): 中继
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Application No.: US13465608Application Date: 2012-05-07
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Publication No.: US08477000B2Publication Date: 2013-07-02
- Inventor: Takashi Yuba , Satoshi Takano , Hirofumi Saso
- Applicant: Takashi Yuba , Satoshi Takano , Hirofumi Saso
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2007-239233 20070914; JP2008-089410 20080331
- Main IPC: H01H9/30
- IPC: H01H9/30 ; H01H51/22

Abstract:
A relay is disclosed that includes a first opening and closing part including an openable and closable first gap; a second opening and closing part including an openable and closable second gap, the second opening and closing part being placed side by side with the first opening and closing part so that the first gap and the second gap are arranged side by side; a magnetization driving part configured to cause the first opening and closing part and the second opening and closing part to simultaneously operate; and a permanent magnet configured to apply a magnetic field on the first gap of the first opening and closing part and the second gap of the second opening and closing part in the same direction.
Public/Granted literature
- US20120223790A1 RELAY Public/Granted day:2012-09-06
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