Invention Grant
- Patent Title: Thermal head, thermal printer and manufacturing method for the thermal head
- Patent Title (中): 热敏头，热敏打印机和热头的制造方法
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Application No.: US13136005Application Date: 2011-07-20
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Publication No.: US08477166B2Publication Date: 2013-07-02
- Inventor: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant: Toshimitsu Morooka , Keitaro Koroishi , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2010-188155 20100825
- Main IPC: B41J2/335
- IPC: B41J2/335
Abstract:
A thermal head comprises a first substrate having a concave portion, a second substrate mounted on the first substrate and covering the concave portion to form with the first substrate a cavity portion, a heating resistor provided on a surface of the second substrate, and a pair of electrodes connected to the heating resistor for supplying power to the heating resistor. At least one of the pair of electrodes has a low thermal conductivity portion in a region opposed to the cavity portion. The low thermal conductivity portion is made of a material having a thermal conductivity lower than a thermal conductivity in other regions of the pair of electrodes and having an electrical resistance lower than an electrical resistance of the heating resistor.
Public/Granted literature
- US20120050447A1 Thermal head, thermal printer and manufacturing method for the thermal head Public/Granted day:2012-03-01
Information query
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