Invention Grant
- Patent Title: Formed PCB
- Patent Title (中): 形成PCB
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Application No.: US12859712Application Date: 2010-08-19
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Publication No.: US08477492B2Publication Date: 2013-07-02
- Inventor: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- Applicant: Fletcher R. Rothkopf , Phillip M. Hobson , Adam Mittleman , Anna-Katrina Shedletsky
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agent Jennifer Luh
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G06F1/16

Abstract:
Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.
Public/Granted literature
- US20120044637A1 FORMED PCB Public/Granted day:2012-02-23
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