Invention Grant
US08481866B2 Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
失效
相邻的电镀通孔具有交错耦合，用于高速印刷电路板中的串扰降低
- Patent Title: Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
- Patent Title (中): 相邻的电镀通孔具有交错耦合，用于高速印刷电路板中的串扰降低
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Application No.: US13187173Application Date: 2011-07-20
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Publication No.: US08481866B2Publication Date: 2013-07-09
- Inventor: Jason Edward Chan , Jose Ricardo Paniagua
- Applicant: Jason Edward Chan , Jose Ricardo Paniagua
- Applicant Address: US CT Wallingford
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Blank Rome LLP
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.
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