- 专利标题： Pad bonding employing a self-aligned plated liner for adhesion enhancement
-
申请号： US12575980申请日： 2009-10-08
-
公开(公告)号： US08482132B2公开(公告)日： 2013-07-09
- 发明人: Chih-Chao Yang , David V. Horak , Takeshi Nogami , Shom Ponoth
- 申请人： Chih-Chao Yang , David V. Horak , Takeshi Nogami , Shom Ponoth
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Parashos Kalaitzis, Esq.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
Two substrates are brought together and placed in a plating bath. In one embodiment, a conductive material is plated in microscopic cavities present at the interface between a first metal pad and a second metal pad to form at least one interfacial plated metal liner portion that adheres to a surface of the first metal pad and a surface of the second metal pad. In another embodiment, at least one metal pad is recessed relative to a dielectric surface before being brought together. The two substrates are placed in a plating bath and a conductive material is plated in the cavity between the first metal pad and the second metal pad to form a contiguous plated metal liner layer that adheres to a surface of the first metal pad and a surface of the second metal pad.