Invention Grant
- Patent Title: Chip-type coil component
- Patent Title (中): 片式线圈组件
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Application No.: US13331673Application Date: 2011-12-20
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Publication No.: US08482371B2Publication Date: 2013-07-09
- Inventor: Dong Jin Jeong , Jae Wook Lee
- Applicant: Dong Jin Jeong , Jae Wook Lee
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0040829 20110429
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/28

Abstract:
The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.
Public/Granted literature
- US20120274432A1 CHIP-TYPE COIL COMPONENT Public/Granted day:2012-11-01
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