发明授权
- 专利标题： Systems for circuit board heat transfer and method of assembling same
- 专利标题（中）： 电路板传热系统及其组装方法
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申请号： US13109253申请日： 2011-05-17
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公开(公告)号： US08482929B2公开(公告)日： 2013-07-09
- 发明人: David S. Slaton , David McDonald , Jerry L. Wright
- 申请人： David S. Slaton , David McDonald , Jerry L. Wright
- 申请人地址： US NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Schenectady
- 代理机构： Global Patent Operation
- 代理商 Mark A. Conklin
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.