Invention Grant
- Patent Title: Stamping-laminating apparatus and method
- Patent Title (中): 冲压成型装置及方法
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Application No.: US13090341Application Date: 2011-04-20
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Publication No.: US08485238B2Publication Date: 2013-07-16
- Inventor: Kazuyuki Hirata
- Applicant: Kazuyuki Hirata
- Applicant Address: JP Aichi-ken
- Assignee: Toyota Boshoku Kabushiki Kaisha
- Current Assignee: Toyota Boshoku Kabushiki Kaisha
- Current Assignee Address: JP Aichi-ken
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2010-110248 20100512
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B32B38/04 ; B32B38/10

Abstract:
Punching structures each include a die, a punch that cooperates with the die to stamp a workpiece, a die supporting member that applies lateral pressure to core pieces stamped out from the workpiece, and a counter pressure applying mechanism that applies counter pressure toward the punch to the core pieces from the side opposite to the punch. The punching structures also include selecting mechanisms, respectively. The punching structures laminate core pieces while applying lateral pressure and counter pressure to the core pieces. The punching structures are arranged along the conveyance direction of the workpiece. The selecting mechanisms select one of the punching structures to be put in a pause state, so that one of the punching structures is put in a pause state during a stamping operation of the punching structures.
Public/Granted literature
- US20110277939A1 STAMPING-LAMINATING APPARATUS AND METHOD Public/Granted day:2011-11-17
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