Invention Grant
- Patent Title: Heat pipe, heat dissipating module and illumination device
- Patent Title (中): 热管，散热模块和照明装置
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Application No.: US13281430Application Date: 2011-10-26
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Publication No.: US08485698B2Publication Date: 2013-07-16
- Inventor: Chia-Chun Cheng , Lei-Lei Liu
- Applicant: Chia-Chun Cheng , Lei-Lei Liu
- Applicant Address: TW Zhonghe Dist., New Taipei
- Assignee: Cooler Master Co., Ltd.
- Current Assignee: Cooler Master Co., Ltd.
- Current Assignee Address: TW Zhonghe Dist., New Taipei
- Agent Winston Hsu; Scott Margo
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V29/02 ; F28D15/02
Abstract:
A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.
Public/Granted literature
- US20130107547A1 HEAT PIPE, HEAT DISSIPATING MODULE AND ILLUMINATION DEVICE Public/Granted day:2013-05-02
Information query
