Invention Grant
US08487413B2 Passivation film for electronic device and method of manufacturing the same 失效
电子器件钝化膜及其制造方法

Passivation film for electronic device and method of manufacturing the same
Abstract:
Disclosed are a passivation film for an electronic device having a nitride film formed on a substrate by a plasma-enhanced chemical vapor deposition (PECVD) method using a silicon-containing gas and a nitrogen-containing gas and a plasma-processed film formed by plasma processing a surface of the nitride film by a PECVD method using an NH3 gas, an N2 gas, and a H2 gas, and a method of manufacturing the passivation film.
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