发明授权
- 专利标题： Method and system for providing a reliable semiconductor assembly
- 专利标题（中）： 提供可靠的半导体组件的方法和系统
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申请号： US11942794申请日： 2007-11-20
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公开(公告)号： US08487428B2公开(公告)日： 2013-07-16
- 发明人: Michael G. Lee
- 申请人： Michael G. Lee
- 申请人地址： JP Kawasaki-shi
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Baker Botts L.L.P.
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60
摘要：
A semiconductor assembly is provided that includes a substrate. A first set of non-conductive hedges is disposed on and protrudes from a first surface of the substrate. A chip is coupled to and spaced apart from the substrate. The chip has a second surface facing the first surface of the substrate. A second set of non-conductive hedges is disposed on and protrudes from the second surface of the chip. The first set of hedges is configured and positioned to engage the second set of hedges to restrict movement of the substrate with respect to the chip. The second set of hedges is configured and positioned to engage the first set of hedges to restrict movement of the chip with respect to the substrate.
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