发明授权
- 专利标题： Memory module having thermal conduits
- 专利标题（中）： 具有热导管的存储器模块
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申请号： US12916945申请日： 2010-11-01
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公开(公告)号： US08488325B1公开(公告)日： 2013-07-16
- 发明人: Enchao Yu
- 申请人： Enchao Yu
- 申请人地址： US CA Irvine
- 专利权人： Netlist, Inc.
- 当前专利权人： Netlist, Inc.
- 当前专利权人地址： US CA Irvine
- 代理商 Jamie J. Zheng, Esq.
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28F7/00 ; H01L23/26 ; H01L23/34
摘要：
A memory module is provided having a plurality of integrated circuit packages. The memory module includes a first thermal conduit in thermal communication with a first set of integrated circuit packages on the first side, and substantially thermally isolated from a second set of one or more integrated circuit packages on the first side. The memory module further includes a second thermal conduit in thermal communication with the set of one or more integrated circuit packages.
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