Invention Grant
- Patent Title: Thermal management for light emitting diode fixture
- Patent Title (中): 发光二极管夹具的热管理
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Application No.: US12235146Application Date: 2008-09-22
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Publication No.: US08491166B2Publication Date: 2013-07-23
- Inventor: Evans Edward Thompson, III
- Applicant: Evans Edward Thompson, III
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLC
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member from which fins extend. Each fin can include one or more straight and/or curved portions. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.
Public/Granted literature
- US20090129086A1 Thermal Management for Light Emitting Diode Fixture Public/Granted day:2009-05-21
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