A micro via adapter socket (12) is provided by a printed circuit board (30) having an upper layer (32), a lower layer (40) and intermediate interconnect layers (34, 36 and 38). The lower layer (32) has an array of mini vias (60) formed therein for receiving respective ones of mini-springs (62). A top plate (42) is secured above the upper layer (32). The top plate (42) has a plurality of micro-pin recesses (54) spaced apart for registering with respective ones of the micro vias (48) and receiving micro-pins (52). A bottom plate (44) is secured beneath the lower layer (40). The bottom plate (44) has a plurality of mini-pin recesses (66) for removably receiving respective ones of the mini-pins (64). The intermediate interconnect layers (34, 36 and 38) have conductive tracks (76) which electrically connect between the micro vias (48) and the mini vias (60).