Invention Grant
- Patent Title: Card adapter
- Patent Title (中): 卡适配器
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Application No.: US12810530Application Date: 2008-12-29
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Publication No.: US08491339B2Publication Date: 2013-07-23
- Inventor: Yasuyoshi Matsumoto , Yuichi Hasegawa , Mitsuhiro Tomita , Yuji Naito , Yoko Takeuchi
- Applicant: Yasuyoshi Matsumoto , Yuichi Hasegawa , Mitsuhiro Tomita , Yuji Naito , Yoko Takeuchi
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- Priority: JP2007-339299 20071228; JP2007-339503 20071228; JP2008-151210 20080610; JP2008-151214 20080610
- International Application: PCT/US2008/088475 WO 20081229
- International Announcement: WO2009/086530 WO 20090709
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A card adapter (10) is configured to receive a first card (20) and to be inserted into a card connector (1) into which a second card may be mated. The card adapter includes a housing having first (120) and second (110) intermateable insulative plate members and a circuit member (130) arranged in the housing. The circuit member includes a plurality of adapter side contact pads (136), each being configured to contact a terminal of the card connector, and a plurality of conductive leads (133), each lead extending between one of the adapter side contact pads and a termination end (134, 135). A plurality of connection terminals (150) are provided with each being interconnected to one of the termination ends of the conductive leads and configured to engage a contact pad (251) of the first card. The first plate member may include a plurality of deformable projections (127) configured to engage a first surface of the circuit member and press the circuit member against the second plate member. The circuit member may have a plurality of through-holes with the terminals having solder tails that extend into the through holes.
Public/Granted literature
- US20110003513A1 CARD ADAPTER Public/Granted day:2011-01-06
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