Invention Grant
- Patent Title: Socket assembly
- Patent Title (中): 插座装配
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Application No.: US13232984Application Date: 2011-09-14
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Publication No.: US08491343B2Publication Date: 2013-07-23
- Inventor: Jun-Hui Wang , Li-Ren Fu , Han-Bing Zhang , Al-Ling He
- Applicant: Jun-Hui Wang , Li-Ren Fu , Han-Bing Zhang , Al-Ling He
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110250818 20110829
- Main IPC: H01H25/00
- IPC: H01H25/00

Abstract:
A socket assembly includes a base and a number of sockets. The base includes a bottom wall and two sidewalls. A conductive base is formed on the bottom wall and forms at least two conductive pieces parallel to the sidewalls. An extension plate extends from the top of one of the sidewalls toward the other sidewall. A number of cutouts are defined in the bottom surface of the extension plate. Each socket includes a main body and a fixing member mounted on the top of the main body. The manipulation of the fixing member allows the repositioning of a socket within the base, or the removal of a socket.
Public/Granted literature
- US20130052840A1 SOCKET ASSEMBLY Public/Granted day:2013-02-28
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