发明授权
- 专利标题： Wire arrangement body, busbar module and power-supply unit
- 专利标题（中）： 电线排列体，母线模块和电源单元
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申请号： US12858678申请日： 2010-08-18
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公开(公告)号： US08492024B2公开(公告)日： 2013-07-23
- 发明人: Shigeyuki Ogasawara , Keizo Aoki
- 申请人： Shigeyuki Ogasawara , Keizo Aoki
- 申请人地址： JP Tokyo
- 专利权人： Yazaki Corporation
- 当前专利权人： Yazaki Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2009-215511 20090917
- 主分类号： H01M2/02
- IPC分类号： H01M2/02
摘要：
A wire arrangement body includes: a wire arrangement groove portion of a tank shape that has a bottom wall portion and both side wall portions; a lid portion that is rotatably connected to one side wall portion of the wire arrangement groove portion through a hinge and covers the wire arrangement groove portion so as to seal a groove opening of the wire arrangement groove portion; and an engagement portion that causes the lid portion to engage with the other side wall portion of the wire arrangement groove portion when the lid portion covers the wire arrangement groove portion. The wire arrangement body is provided so that a center position of the hinge and a center position of the engagement portion are aligned in parallel with a width direction of the wire arrangement body.
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