Invention Grant
- Patent Title: Patterning process
- Patent Title (中): 图案化过程
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Application No.: US13010318Application Date: 2011-01-20
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Publication No.: US08492078B2Publication Date: 2013-07-23
- Inventor: Jun Hatakeyama , Takeshi Nagata , Koji Hasegawa
- Applicant: Jun Hatakeyama , Takeshi Nagata , Koji Hasegawa
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-009869 20100120; JP2010-227196 20101007
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
A pattern is formed by coating a resist composition comprising a polymer comprising recurring units having an optionally acid labile group-substituted naphthol group, an acid generator, and an organic solvent onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, baking, and developing the exposed film with an organic solvent developer to form a negative pattern wherein the unexposed region of film is dissolved and the exposed region of film is not dissolved. In the process of image formation via positive/negative reversal by organic solvent development, the resist film has a high dissolution contrast and controlled acid diffusion. By subjecting the resist film to exposure through a mask having a lattice-like pattern and organic solvent development, a fine hole pattern can be formed at a high precision of dimensional control.
Public/Granted literature
- US20110177462A1 PATTERNING PROCESS Public/Granted day:2011-07-21
Information query
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