Invention Grant
US08492170B2 UV assisted silylation for recovery and pore sealing of damaged low K films 有权
UV辅助甲硅烷基化用于恢复和损坏的低K膜的孔密封

UV assisted silylation for recovery and pore sealing of damaged low K films
Abstract:
Methods for the repair of damaged low k films are provided. Damage to the low k films occurs during processing of the film such as during etching, ashing, and planarization. The processing of the low k film causes water to store in the pores of the film and further causes hydrophilic compounds to form in the low k film structure. Repair processes incorporating ultraviolet (UV) radiation and silylation compounds remove the water from the pores and further remove the hydrophilic compounds from the low k film structure.
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