发明授权
- 专利标题: Manufacturing method of semiconductor substrate
- 专利标题(中): 半导体衬底的制造方法
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申请号: US13040302申请日: 2011-03-04
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公开(公告)号: US08492248B2公开(公告)日: 2013-07-23
- 发明人: Koichiro Tanaka
- 申请人: Koichiro Tanaka
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2008-014147 20080124
- 主分类号: H01L21/322
- IPC分类号: H01L21/322
摘要:
A surface of a single crystal semiconductor substrate is irradiated with ions to form a damaged region, an insulating layer is formed over the surface of the single crystal semiconductor substrate, and a surface of a substrate having an insulating surface is made to be in contact with a surface of the insulating layer to bond the substrate having an insulating surface to the single crystal semiconductor substrate. Then, the single crystal semiconductor substrate is separated at the damaged region by performing heat treatment to form a single crystal semiconductor layer over the substrate having an insulating surface, and the single crystal semiconductor layer is patterned to form a plurality of island-shaped semiconductor layers. One of the island-shaped semiconductor layers is irradiated with a laser beam which is shaped to entirely cover the island-shaped semiconductor layer.
公开/授权文献
- US20110151593A1 MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE 公开/授权日:2011-06-23
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