发明授权
- 专利标题： IC having viabar interconnection and related method
- 专利标题（中）： IC具有viabar互连及相关方法
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申请号： US13410466申请日： 2012-03-02
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公开(公告)号： US08492268B2公开(公告)日： 2013-07-23
- 发明人: Dureseti Chidambarrao , Stephen E. Greco , Kia S. Low
- 申请人： Dureseti Chidambarrao , Stephen E. Greco , Kia S. Low
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Hoffman Warnick LLC
- 代理商 Katherine S. Brown
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
公开/授权文献
- US20120164758A1 IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD 公开/授权日：2012-06-28
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