发明授权
- 专利标题: Printed circuit boards
- 专利标题(中): 印刷电路板
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申请号: US12526586申请日: 2008-02-18
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公开(公告)号: US08492898B2公开(公告)日: 2013-07-23
- 发明人: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- 申请人: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- 申请人地址: GB London
- 专利权人: Semblant Global Limited
- 当前专利权人: Semblant Global Limited
- 当前专利权人地址: GB London
- 代理机构: Baker Botts L.L.P.
- 优先权: GB0703172.7 20070219
- 国际申请: PCT/GB2008/000552 WO 20080218
- 国际公布: WO2008/102113 WO 20080828
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H05K1/00
摘要:
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
公开/授权文献
- US20100025091A1 Printed Circuit Boards 公开/授权日:2010-02-04