发明授权
US08492959B2 Structure for bonding metal plate and piezoelectric body and bonding method
有权
用于接合金属板和压电体的结构和接合方法
- 专利标题: Structure for bonding metal plate and piezoelectric body and bonding method
- 专利标题(中): 用于接合金属板和压电体的结构和接合方法
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申请号: US13337331申请日: 2011-12-27
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公开(公告)号: US08492959B2公开(公告)日: 2013-07-23
- 发明人: Hiroki Kitayama , Hideo Nakagoshi , Kiyoshi Kurihara
- 申请人: Hiroki Kitayama , Hideo Nakagoshi , Kiyoshi Kurihara
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2009-168633 20090717
- 主分类号: H01L41/08
- IPC分类号: H01L41/08
摘要:
A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.