A probe card transmitting electrical test signals between a tester and a semiconductor device includes a main circuit board configured to receive and transmit electrical signals from the tester, an interface unit electrically connected to the main circuit board, the interface unit including a signal line and a signal connection terminal, and at least one probe unit connected to the interface unit, the probe unit being detachable and including a plurality of probe needles arranged in a pattern corresponding to a pattern of electrode pads of the semiconductor device.