Invention Grant
- Patent Title: Pressing member, pressing structure for heat receiving block of substrate, and electronic device
- Patent Title (中): 按压构件，基板的受热块的按压结构和电子装置
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Application No.: US12842895Application Date: 2010-07-23
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Publication No.: US08493737B2Publication Date: 2013-07-23
- Inventor: Koji Abe , Takeshi Hongo
- Applicant: Koji Abe , Takeshi Hongo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2009-228035 20090930
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00
Abstract:
According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one end of the first arm being connected to one longitudinal end of the pressing portion, other end of the first arm being connected to the substrate; and a second arm, one end of the second arm being connected to other longitudinal end of the pressing portion, other end of the second arm being connected to the substrate, wherein the first arm and the second arm are connected to the pressing portion in a bent shape as seen in a planar view from above a surface of the substrate.
Public/Granted literature
- US20110075370A1 PRESSING MEMBER, PRESSING STRUCTURE FOR HEAT RECEIVING BLOCK OF SUBSTRATE, AND ELECTRONIC DEVICE Public/Granted day:2011-03-31
Information query
