发明授权
- 专利标题: Semiconductor device and electronic device
- 专利标题(中): 半导体器件和电子器件
-
申请号: US13365358申请日: 2012-02-03
-
公开(公告)号: US08493765B2公开(公告)日: 2013-07-23
- 发明人: Takayuki Yoshida , Mitsumi Itou , Shinya Tokunaga
- 申请人: Takayuki Yoshida , Mitsumi Itou , Shinya Tokunaga
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2009-184381 20090807
- 主分类号: G11C5/06
- IPC分类号: G11C5/06
摘要:
All interface pins for transmitting and receiving a signal having a predetermined function of a semiconductor integrated circuit element are formed on an outer periphery of the semiconductor integrated circuit element along one side of the semiconductor integrated circuit element. The one side of the semiconductor integrated circuit element is adjacent to two of sides of a BGA substrate, the two sides being not parallel to the one side. Of balls provided on the BGA substrate, balls electrically connected to the interface pins for transmitting and receiving a signal having a predetermined function are provided between the one side of the semiconductor integrated circuit element and the two sides of the BGA substrate.
公开/授权文献
- US20120127774A1 SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE 公开/授权日:2012-05-24
信息查询