Invention Grant
US08496873B2 Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
失效
SN-CU-AG的合金纳米颗粒，其制备方法和使用合金纳米粒子的油墨或糊剂
- Patent Title: Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
- Patent Title (中): SN-CU-AG的合金纳米颗粒，其制备方法和使用合金纳米粒子的油墨或糊剂
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Application No.: US13495887Application Date: 2012-06-13
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Publication No.: US08496873B2Publication Date: 2013-07-30
- Inventor: Kwi-Jong Lee , Hyuck-Mo Lee , Hyun-Joon Song , Yun-Hwan Jo , Ji-Chan Park , Jung-Up Bang , Dong-Hoon Kim
- Applicant: Kwi-Jong Lee , Hyuck-Mo Lee , Hyun-Joon Song , Yun-Hwan Jo , Ji-Chan Park , Jung-Up Bang , Dong-Hoon Kim
- Applicant Address: KR
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0078611 20080811
- Main IPC: C22C13/00
- IPC: C22C13/00
Abstract:
The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
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