发明授权
- 专利标题： Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate
- 专利标题（中）： 用于光伏组件的封装层，光伏组件和用于制造再生光伏电池和再生的透明正面基板的方法
-
申请号： US13071781申请日： 2011-03-25
-
公开(公告)号： US08497140B2公开(公告)日： 2013-07-30
- 发明人: Kasumi Ol , Takaki Miyachi , Isao Inoue , Koujiro Ohkawa , Hiroki Nakagawa
- 申请人： Kasumi Ol , Takaki Miyachi , Isao Inoue , Koujiro Ohkawa , Hiroki Nakagawa
- 申请人地址： JP Tokyo-to
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Tokyo-to
- 代理机构： Ladas & Parry LLP
- 优先权： JP2003-318544 20030910; JP2004-157847 20040527
- 主分类号： H01L31/18
- IPC分类号： H01L31/18
摘要：
An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.
公开/授权文献
信息查询
IPC分类:
