Invention Grant
- Patent Title: Terminal face contact structure and method of making same
- Patent Title (中): 端子面接触结构及其制作方法
-
Application No.: US12991581Application Date: 2009-03-10
-
Publication No.: US08497578B2Publication Date: 2013-07-30
- Inventor: Elke Zakel , Thorsten Teutsch
- Applicant: Elke Zakel , Thorsten Teutsch
- Applicant Address: DE Nauen
- Assignee: Pac Tech—Packaging Technologies GmbH
- Current Assignee: Pac Tech—Packaging Technologies GmbH
- Current Assignee Address: DE Nauen
- Agency: Quarles & Brady LLP
- Priority: DE102008023422 20080514
- International Application: PCT/DE2009/000311 WO 20090310
- International Announcement: WO2009/138048 WO 20091119
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The invention relates to a contact structure (24) and to a method for producing a contact structure for semiconductor substrates (21) or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part (22) arranged on a terminal face (20) of the semiconductor substrate and at least one connecting contact part (23) arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material (34) which has a lower melting point than a base contact material of the base contact part.
Public/Granted literature
- US20110057312A1 CONTACT STRUCTURE AND METHOD FOR PRODUCING A CONTACT STRUCTURE Public/Granted day:2011-03-10
Information query
IPC分类:
