Invention Grant
- Patent Title: Airflow management for particle abatement in semiconductor manufacturing equipment
- Patent Title (中): 半导体制造设备中颗粒减少的气流管理
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Application No.: US11752118Application Date: 2007-05-22
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Publication No.: US08500382B2Publication Date: 2013-08-06
- Inventor: James S. Castantini , Tent-Chao D. Tao , Erin M. Madden , Donald N. Polner
- Applicant: James S. Castantini , Tent-Chao D. Tao , Erin M. Madden , Donald N. Polner
- Applicant Address: US MA Beverly
- Assignee: Axcelis Technologies Inc.
- Current Assignee: Axcelis Technologies Inc.
- Current Assignee Address: US MA Beverly
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
An airflow management system and/or method used in particle abatement in semiconductor manufacturing equipment. In particular, the apparatus disclosed is capable of creating and managing a carefully controlled particle free environment for the handling of semiconductor wafers or similar articles. The apparatus is particularly suited to be used as an interface between an equipment front end module (EFEM) and a vacuum loadlock chamber or other such article of process equipment. The apparatus also enables relative motion between enclosures while maintaining a particle free environment utilizing a moving air diffuser mounted to an interface panel.
Public/Granted literature
- US20080292432A1 AIRFLOW MANAGEMENT FOR PARTICLE ABATEMENT IN SEMICONDUCTOR MANUFACTURING EQUIPMENT Public/Granted day:2008-11-27
Information query
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