Invention Grant
- Patent Title: Attachment mechanism for electronic component
- Patent Title (中): 电子元件附件机构
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Application No.: US13427923Application Date: 2012-03-23
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Publication No.: US08500457B2Publication Date: 2013-08-06
- Inventor: Zheng-Heng Sun
- Applicant: Zheng-Heng Sun
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110435051 20111222
- Main IPC: H01R12/52
- IPC: H01R12/52

Abstract:
An attachment mechanism for fastening an electronic component includes a circuit board and a fastener. The circuit board includes a first connector to be connected to a second connector of the electronic component. The first connector defines a groove in a first end of the first connector and a hooking slot below the groove. The fastener includes a main body and an operation portion extending up from the main body. The main body includes a block engaging in the groove and a latch engaging in the hooking slot. An engaging bar protrudes from the operation portion to abut against a top of the electronic component.
Public/Granted literature
- US20130164953A1 ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT Public/Granted day:2013-06-27
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