发明授权
US08501372B2 Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
有权
掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
- 专利标题: Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
- 专利标题(中): 掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
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申请号: US13248896申请日: 2011-09-29
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公开(公告)号: US08501372B2公开(公告)日: 2013-08-06
- 发明人: Atsushi Kominato , Masahiro Hashimoto , Osamu Nozawa
- 申请人: Atsushi Kominato , Masahiro Hashimoto , Osamu Nozawa
- 申请人地址: JP Tokyo
- 专利权人: Hoya Corporation
- 当前专利权人: Hoya Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2010-221661 20100930
- 主分类号: G03F1/26
- IPC分类号: G03F1/26
摘要:
A mask blank for use in the manufacture of a binary mask adapted to be applied with ArF excimer laser exposure light has, on a transparent substrate, a light-shielding film for forming a transfer pattern. The light-shielding film has a laminated structure of a lower layer and an upper layer and has an optical density of 2.8 or more for exposure light and a thickness of 45 nm or less. The lower layer is made of a material in which the total content of a transition metal and silicon is 90 at % or more, and has a thickness of 30 nm or more. The upper layer has a thickness of 3 nm or more and 6 nm or less. The phase difference between exposure light transmitted through the light-shielding film and exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 30 degrees or less.
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