发明授权
US08501561B2 Method for producing a semiconductor component arrangement comprising a trench transistor
有权
一种用于制造包括沟槽晶体管的半导体部件装置的方法
- 专利标题: Method for producing a semiconductor component arrangement comprising a trench transistor
- 专利标题(中): 一种用于制造包括沟槽晶体管的半导体部件装置的方法
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申请号: US12987847申请日: 2011-01-10
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公开(公告)号: US08501561B2公开(公告)日: 2013-08-06
- 发明人: Markus Zundel , Franz Hirler , Norbert Krischke
- 申请人: Markus Zundel , Franz Hirler , Norbert Krischke
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Maginot, Moore & Beck
- 优先权: DE102006010510 20060307
- 主分类号: H01L29/768
- IPC分类号: H01L29/768
摘要:
Disclosed is a semiconductor component arrangement and a method for producing a semiconductor component arrangement. The method comprises producing a trench transistor structure with at least one trench disposed in the semiconductor body and with at least an gate electrode disposed in the at least one trench. An electrode structure is disposed in at least one further trench and comprises at least one electrode. The at least one trench of the transistor structure and the at least one further trench are produced by common process steps. Furthermore, the at least one electrode of the electrode structure and the gate electrode are produced by common process steps.
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