Invention Grant
- Patent Title: Method for fabricating gate structure
- Patent Title (中): 栅极结构的制造方法
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Application No.: US13045291Application Date: 2011-03-10
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Publication No.: US08501634B2Publication Date: 2013-08-06
- Inventor: Shao-Wei Wang , Gin-Chen Huang , Tsuo-Wen Lu , Chien-Liang Lin , Yu-Ren Wang
- Applicant: Shao-Wei Wang , Gin-Chen Huang , Tsuo-Wen Lu , Chien-Liang Lin , Yu-Ren Wang
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
A gate structure and a method for fabricating the same are described. A substrate is provided, and a gate dielectric layer is formed on the substrate. The formation of the gate dielectric layer includes depositing a silicon nitride layer on the substrate by simultaneously introducing a nitrogen-containing gas and a silicon-containing gas. A gate is formed on the gate dielectric layer, so as to form the gate structure.
Public/Granted literature
- US20120228723A1 GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-09-13
Information query
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