A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body.