Invention Grant
- Patent Title: Camera module and method for manufacturing camera module
- Patent Title (中): 相机模块及相机模块制造方法
-
Application No.: US13711755Application Date: 2012-12-12
-
Publication No.: US08506185B2Publication Date: 2013-08-13
- Inventor: Koki Sato , Mitsuru Kobayashi , Tetsugaku Tanaka , Hideo Miyazawa
- Applicant: Fujitsu Component Limited
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2010-124943 20100531; JP2011-094340 20110420
- Main IPC: G03B17/00
- IPC: G03B17/00
Abstract:
A camera module includes a camera unit, a board, and a driving unit mounted on the board and configured to drive the camera unit. The camera module also includes an elastic camera-side connecting part configured to connect a terminal of the camera unit with wiring on a first surface of the board.
Public/Granted literature
- US20130101281A1 CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE Public/Granted day:2013-04-25
Information query
