Invention Grant
- Patent Title: Cable assembly for a connector system
- Patent Title (中): 连接器系统的电缆组件
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Application No.: US13685137Application Date: 2012-11-26
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Publication No.: US08506323B2Publication Date: 2013-08-13
- Inventor: Brian Patrick Costello
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R11/00
- IPC: H01R11/00

Abstract:
A cable assembly includes a first header connector that includes a housing that holds a plurality of contacts. The housing of the first header connector has a first mating interface. The cable assembly also includes a second header connector having a housing that holds a plurality of contacts. The housing of the second header connector has a second mating interface facing in an opposite direction from the first mating interface. The first and second header connectors are identical to one another. A cable bundle has a plurality of cables extending between the first and second header connectors. The cables are connected between the contacts of the first header connector and corresponding contacts of the second header connector.
Public/Granted literature
- US20130084735A1 CABLE ASSEMBLY FOR A CONNECTOR SYSTEM Public/Granted day:2013-04-04
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