Invention Grant
- Patent Title: Light emitting diode package
- Patent Title (中): 发光二极管封装
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Application No.: US12659419Application Date: 2010-03-09
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Publication No.: US08507926B2Publication Date: 2013-08-13
- Inventor: Chao-Hung Weng , Fu-Ming Chuang
- Applicant: Chao-Hung Weng , Fu-Ming Chuang
- Applicant Address: TW
- Assignee: Coretronic Corporation
- Current Assignee: Coretronic Corporation
- Current Assignee Address: TW
- Agency: Bacon & Thomas, PLLC
- Priority: TW98109662A 20090325
- Main IPC: H01L21/18
- IPC: H01L21/18 ; H01L33/00
Abstract:
A light emitting diode package includes a substrate, a plurality of light emitting diode chips, a fluorescence layer, and a plurality of reflecting layers. The light emitting diode chips, the fluorescence layer, and the reflecting layers are disposed on the substrate. The fluorescence layer covers the light emitting diode chips, and the reflecting layers are disposed right above the light emitting diode chips, respectively.
Public/Granted literature
- US20100244058A1 Light emitting diode package Public/Granted day:2010-09-30
Information query
IPC分类:
