Invention Grant
- Patent Title: Circuit for thermal protection in audio power amplifier and method thereof
- Patent Title (中): 音频功率放大器热保护电路及其方法
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Application No.: US13229204Application Date: 2011-09-09
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Publication No.: US08508300B2Publication Date: 2013-08-13
- Inventor: Kung-Wang Lee , Tung-Tsai Liao
- Applicant: Kung-Wang Lee , Tung-Tsai Liao
- Applicant Address: TW Hsinchu
- Assignee: Generalplus Technology Inc.
- Current Assignee: Generalplus Technology Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW99134659A 20101012
- Main IPC: H02H7/20
- IPC: H02H7/20
Abstract:
The present invention relates to audio amplifier and a method for protecting the audio amplifier. The audio amplifier includes a pre-amp circuit, an output stage power amplifier, a temperature detector and a gain adjusting circuit. The pre-amp circuit receives an audio signal for amplifying the audio signal to generate an amplified audio signal. The output stage power amplifier receives the amplified audio signal to drive a load. The temperature detector is used for detecting a temperature of the output stage power amplifier to output a temperature signal. The gain adjusting circuit adjusts amplitude of the amplified audio signal of the pre-amp circuit according to the temperature signal.
Public/Granted literature
- US20120086508A1 CIRCUIT FOR THERMAL PROTECTION IN AUDIO POWER AMPLIFIER AND METHOD THEREOF Public/Granted day:2012-04-12
Information query
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