Invention Grant
- Patent Title: Laminate type electronic component and manufacturing method therefor
- Patent Title (中): 层压型电子元件及其制造方法
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Application No.: US13337445Application Date: 2011-12-27
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Publication No.: US08508913B2Publication Date: 2013-08-13
- Inventor: Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
- Applicant: Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-000388 20110105
- Main IPC: H01G4/228
- IPC: H01G4/228

Abstract:
In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
Public/Granted literature
- US20120169180A1 LAMINATE TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR Public/Granted day:2012-07-05
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